INR
Description
Copper bonded Earthing Plates are manufactured as per international norms conforming to IS 3043:2018, NBC 2016 and is available in minimum 100 microns coating thickness. Copper Bonded Earthing Plates are recommended where electrodes of large surface area are necessary to provide the requisite current carrying capacity and are used as an earthing solution where earth rods are not suitable.In order to reduce the number of connection beneath the soil, Strips are welded into Mild steel plate prior to copper electroplating.